PI Advanced Materials is the manufacturer of these specialist polymer based Polyimide films. Polyimide film possesses excellent chemical and extreme high temperature resistance. It is an excellent choice for a variety of applications such as flexible printed circuits. Polyimide products are proven for a range of insulation applications, including interior insulation blankets and meet the stringent requirements of the aerospace industry.
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Able to withstand extreme temperatures ranging from absolute zero to 400°C, Our Pl film solutions can help downstream customers advance their manufacturing process under any environmental temperatures.
Pl film retains its original shape and form over a wide temperature range for durability and reliability of the end products.
Pl film is a corona discharge resistant, electrical insulating material that can be used in high voltage environments for stablity of electronic devices.
Due to its excellent bendability and dimensional stability, Pl film is suitable for flexible/foldable applications, and affords flexibility in PCB design.
Description
Polyimide Film GF is a high-performance polymer film specifically engineered for Flexible Copper Clad Laminates (FCCL) and Flexible Printed Circuits (FPCs) that require exceptional thermal resistance, mechanical durability, and dimensional stability.
Developed for advanced electronic fabrication processes, the GF grade offers enhanced resistance to heat and chemicals, ensuring strong adhesion to copper foils and adhesives during lamination and etching. With its excellent flexibility and dielectric properties, Polyimide Film GF provides the stability and reliability needed for high-density, thin, and lightweight circuit applications.
Applications
Description
Polyimide Film GV is a high-performance, heat-resistant polymer film engineered specifically for Flexible Copper Clad Laminates (FCCL) and Flexible Printed Circuits (FPCs). Designed for next-generation flexible electronics, the GV grade offers an optimized balance of thermal stability, mechanical strength, and dimensional control, ensuring outstanding reliability in fine-pitch and high-density interconnect applications.
Produced through precision casting and imidization processes, Polyimide Film GV maintains exceptional adhesion to copper foils and adhesive systems used in FCCL manufacturing. Its superior dielectric properties, flexibility, and chemical resistance make it an ideal base material for applications demanding both high heat tolerance and mechanical durability.
Applications
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